Electronics Forum | Thu Jul 15 11:17:03 EDT 2010 | davef
Things don't disappear completely. If something caused nickel corrosion, the nickel corrosion by-product would be in place of the nickel. Is it possible that ... There never was any nickel? We know that the nickel will diffuse into the copper. Th
Electronics Forum | Mon Nov 13 12:48:14 EST 2000 | Chris McDonald
Anybody have problen soldering a IC with leads that are copper base, plated with 300 u inch min. of 80Sn/20Pb solder? We are having problems soldering a 16 mil QVSOP to a Gold Flash Board. Thanks Chris
Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis
I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin
Electronics Forum | Fri Aug 11 22:14:59 EDT 2017 | dawson
Hi Adonys, What's ICP 1-3? Do you mean IPC? 1. Excess Plating- no excess, but filled with something which generated in the process of copper plating. 2. Dark Vias - it's oxidized. and the solder mask printing is not aligned. The board is failed. M
Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman
Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.
Electronics Forum | Wed Feb 03 06:35:14 EST 1999 | Teemu M�kiniemi
Hi! Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper. Teemu M�kiniemi
Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Electronics Forum | Thu Jan 10 11:22:48 EST 2013 | pbarton
Looks to me like under etching of the underlying copper and the gold is just plated to all of the exposed copper surface. Is this characteristic the same on all solderable pads? You will not be able to remove this gold.
Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House
Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y
Electronics Forum | Thu May 07 08:11:58 EDT 2009 | davef
We don't have a good answer for you, but we do have several thoughts on the issue: * First, tin in your solder or solderability protection is going to diffuse into the copper trace or pad on the board naturally. You can stop that by using a protectiv
