Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Thu Sep 03 12:03:52 EDT 2009 | Sean
Hi All, I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion? 2) I heard that lead fr
Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm
Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned
Electronics Forum | Wed Apr 07 09:23:20 EDT 2004 | davef
In addition to your concerns about leaching, why aren't you concerned about: * Tin whiskers * Total absence of in use reliability information about no-lead, especially given that creep is significantly different between SnPb and no-leads. While they
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef
Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Wed Jan 26 15:55:31 EST 2005 | davef
There is: * NO information to indicate leadfree solder is at all reliable regardless of class of operation. * NO material model for leadfree solder, whereas the model for lead solder was developed over many years back during a time when companies be
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
.gif)
