Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen
I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w
Electronics Forum | Sat Mar 21 06:56:09 EDT 2015 | robertwillis
Think you are talking about tin whiskers and not dendrites which are a different thing? Bob Willis
Electronics Forum | Wed Apr 29 04:57:08 EDT 2009 | davepick
It depends on the application what will be considered the biggest issue to avoid (production or longterm reliability). Tin Whiskers are bit of an unknown quantity - but a more realistic problem could be dendritic growth / electromigration forming sho
Electronics Forum | Wed Mar 04 08:25:49 EST 2009 | scottp
I don't think anyone can give you an answer until you've had some failure analysis done. Silver migration? Dendritic growth? Tin whiskers? Lots of possibilities, but you won't know without failure analysis.
Electronics Forum | Tue Dec 13 04:38:34 EST 2005 | rlackey
Hi, Sorry, English humour. So as not to trivialise an issue so important - yes tin whiskers are a very real problem. I Don't know much about it though, as I didn't get past dendronic growth at Uni. If I ever get the time I will educate myself on
Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel
Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint
Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the
Electronics Forum | Sun Nov 21 21:40:13 EST 2004 | John
I'm experiencing an impedance breakdown on an 0805 ceramic cap. In the application, the cap is at a 16V bias at all times. The unit failed in an extremely high humidity condition. We are using a NC flux and have determined there was flux underneat
Electronics Forum | Fri Mar 10 00:17:47 EST 2006 | Samir
Patrick, My sardonic wit comes from 11 years of being an embattled process guy who�s basically �seen it all� in electronics manufacturing. I�ve been witness to the �Seagull Managers�, uneducated managers lacking credentials, managers with MBAs but
Electronics Forum | Mon Jun 18 17:41:07 EDT 2001 | genny
Hi, I put this on the technet forum, and I know some of the same people are here, but I thought I might catch others here as well. We have PCB's which are populated at the CM level with no-clean solder paste. However in house we use a solder wire s
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