Electronics Forum | Tue Jan 12 11:14:37 EST 2016 | mfgengr2016
After the CCA is been de-paneled I find exposed board fibers. Should the board edge be sealed with an epoxy to keep moisture from getting into the CCA?
Electronics Forum | Fri Mar 03 16:05:42 EST 2006 | Chris
Hi, Anyone ever perform a DOE on prepreg glass bundle direction or glass bundle grain and how or if it affects PCB warpage and chip component cracking at V-score depanel? Since most FR4 and prepreg has has 1.4 times more fiber bundles in one direct
Electronics Forum | Thu Aug 30 21:57:02 EDT 2001 | davef
We don't use fussy things like that to remove mouse-bite tabs when they are not designed to be removed. Just cut away the majority of the waste using sheet metal shears. Then burr the remainder and the rough parts with a Sears wood router [bought a
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
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