Electronics Forum: die attach 0201 (Page 1 of 9)

BGA attach eval.

Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf

I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro

BGA attach eval.

Electronics Forum | Tue Apr 01 11:50:08 EST 2003 | rdr

Dave, thanks for the info. This sounds like it would verify the presence of an open. We have verified that these balls are open and I am trying to figure out if we are fracturing or not wetting. causing these opens. I would use the die method on ne

Die attach with solder paste

Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.

Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t

Die attach with solder paste

Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje

Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where

Die attach with solder paste

Electronics Forum | Fri Aug 30 06:18:55 EDT 2002 | seje

Thanks Jim, that should help. And yes, there is light at the end of the tunnel.... now : ) -Sasu-

0201 caps

Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew

I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s

0201 caps

Electronics Forum | Tue Dec 03 20:54:57 EST 2002 | davef

Q1:A picture of the sectioned MLCC would be nice. A1: I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. R1: You�re correct. You cannot post pix on SMTnet. Please email me t

0201 Capacitor Solder Printing

Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson

Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and

SIPLACE 0201 TEST BOARD

Electronics Forum | Sat Sep 17 20:37:24 EDT 2022 | kumarb

Hi. About 2 years ago we designed a practice test board to confirm our understanding and capabilities of our YV88X PnP machine. We managed to place 01005 parts onto the PCB using a custom nozzle from Shenzhen. See attached - this is just one part of

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon

Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta

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