Electronics Forum | Tue Sep 30 02:11:05 EDT 2003 | msimkin
We are having a problem with one of our chip sets. We have had a sudden change in performance, detrimenatally, and we beleive it may be a result of a change in die size. we need to prove this. Does anybody know a good contact or company who specialis
Electronics Forum | Mon Dec 03 15:46:16 EST 2012 | bmario
Hi, Recently we have found a chip on a card having very small damage on the die corner. I would like to know if there are some industry standard criteria of acceptance available. If not, what would you recommend?
Electronics Forum | Fri Dec 07 11:58:25 EST 2012 | cnotebaert
Thats the one I was thinking of!! thanks Dave!
Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje
Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where
Electronics Forum | Fri Dec 07 09:54:05 EST 2012 | davef
Try MIL-STD-883 Method 2017 Die inspection service providers may be willing to help Services, Die inspection * Amkor amkor.com * Syagrus Systems syagrussystems.com SMTA has published a lot of papers that track to 'die' & 'inspection' but most oft
Electronics Forum | Thu Dec 06 15:27:36 EST 2012 | bmario
The package is flip chip BGA (FCBGA592) I found some info on leadless devices damages in IPC610 but it is not exactly what I am looking for.
Electronics Forum | Mon Mar 11 10:43:06 EDT 2019 | herve53
Hello, Is somebody could support me ? I would like to understand what is the chip on board process. What are process steps to produce a die in COB ?(please with technical details) (from start of the line to end of the production line, cleaning, pick
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Tue Dec 19 07:58:29 EST 2006 | ccgooi
Our company is assembly flip chip on flex, we have new design of flip chip which die temperature will increase until 145 degree C after test run the end product, however the Tg,glass transition temperature is 148. Will this case causing any reliabil
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
