Electronics Forum | Fri Sep 12 17:58:30 EDT 2008 | robinj
Can someone let me know what is causing this black coloration around the pads? It is on the edge of all pads all over the board. The surface finish is OSP. I don't have any solderability issue. But the stencil printer is having trouble with picking u
Electronics Forum | Sat Sep 13 09:36:53 EDT 2008 | davef
Lemme tell ya, those are weird looking pix. If OSP boards have not been dried properly prior to bagging and sealing, water can leak from via and ruin the OSP, which will turn black.
Electronics Forum | Fri Oct 25 13:23:02 EDT 2019 | SMTA-Joe
Hello SMTA, This may be beyond the scope of the SMTA since it does not strictly deal with assembly of electronics, rather, it is about potential solderless methods for manually tuning RF circuits. Our Engineers & QC have tasked manufacturing with
Electronics Forum | Wed Nov 13 18:00:59 EST 2013 | davef
It's too bad that SMTnet won't let us view your pdf. I asked the geeks to fix that. If someone really want to read it Matt can likely get it off to you. Is it OK to do that, Matt? Anyhow, the Trace Labs report seems to be focused on some SMT pad dis
Electronics Forum | Sun Aug 23 11:42:01 EDT 2009 | ysutariya
Hi Dave, I haven't tried the Probimer yet, but the Taiyo ink didn't hold up too well. As a PCB fabricator, finding a white soldermask that has good trace coverage and survives 4X solder immersion (HASL) is like the holy grail of white soldermask.
Electronics Forum | Fri Jan 12 16:35:00 EST 2001 | Steve Thomas
I've got a question: Can a joint look good externally, even under 45X magnification, and not be mechanically and/or electrically sound? I thought that if the wetting angles were sufficient, there's no discoloration from extreme thermal distress, or
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
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