Electronics Forum | Thu Sep 22 16:06:07 EDT 2011 | davef
Underfilling BGA is an uncommon practice. We'd start looking to find a consultant recommended by our: * Dispenser company * Underfill supplier
Electronics Forum | Thu Sep 22 14:54:01 EDT 2011 | hegemon
You might find a lot of experience in the forum here, but maybe not so many consultants for this niche. BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern. Fo
Electronics Forum | Mon Jun 11 10:40:46 EDT 2007 | ramseyn
Jim, Another good resource would be Asymtek (www.asymtek.com) I have had a lot of luck with their dispense equipment for underfilling applications. They have run tests in the past using various methods for our company to determine what type of epoxy
Electronics Forum | Fri Jun 08 15:37:41 EDT 2007 | ck_the_flip
Jim: I have limited knowledge, but here's what I know: 1. Yes, it's a standard process. In today's SMTNet, it's rarely mentioned, and few people reply to postings. 2. Nope. It's a "specialty" piece of equipment for most CEM's. Depending on you
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor
davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro
Electronics Forum | Wed Feb 22 10:02:08 EST 2006 | Aaj
Hi! Why positive displacement technique cannot be used for underfill dispensing? Which is the best technique to dispense underfill?
Electronics Forum | Fri Sep 25 09:51:53 EDT 2020 | majdi4
I didn't understand your request.. Are you talking about underfill process (dispensing) or underfill with tape and reel packaging?? does the component drops at the 2nd reflow? that's why you want to go ahead for underfill process?? Thank you .
Electronics Forum | Fri Apr 09 08:58:28 EDT 1999 | Justin Medernach
| I'm not sure about limits but perhaps underfilling the BGA might easy your mind. Treat the BGA as something similar to a flip chip and dispense underfill around the part. The rigidity gained by the cured underfill may be enough to alleviate some
Electronics Forum | Fri Sep 25 10:02:12 EDT 2020 | SMTA-64386317
Yes, underfill process with dispensing. Customer require component must withstand certain strength.
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