Electronics Forum | Mon May 14 09:35:21 EDT 2018 | directx995
Hello everyone, A few days ago I design one special kind of PCB for testing accuracy of our Pick and Place machines. (for trimming, calibrating, NPI etc.) I am looking for adhesive spray, to apply it on PCB (at the moment I'm using double sided tape
Electronics Forum | Tue Feb 23 09:21:15 EST 1999 | Steve Schrader
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Thu Feb 18 21:20:13 EST 1999 | Ernie Flamont
During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location on
Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22
Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc
Electronics Forum | Mon Aug 23 17:43:18 EDT 2010 | davef
SAG: Questions on solder mask webbing with fine pitch parts are: * What is the minimum pitch that you can use webbing between fine pitch pads? * What solder mask do you use?
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Sun Sep 21 10:03:15 EDT 2014 | gascon5383
hi, there is an IPC standard, IPC-A-610 - Acceptability of Electronic Assemblies. According to this manual, solder in the bends of a lead does not matter, but solder touching the body of a component is a defect. I cannot find a specific reference in
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