Electronics Forum: doe profile (Page 29 of 64)

Re: Profiling

Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey

| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |

Re: Profiling

Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones

| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 17:30:25 EDT 1999 | Mohammad Yunus

| | | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are

Re: Wave Solder Profiling Basics

Electronics Forum | Fri Jun 25 16:54:25 EDT 1999 | C.K.

| | | Dear John/Earl | | | | | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | | | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the

Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan

I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon

Re: Cracking in High Voltage Chip Caps

Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook

| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:06:43 EDT 1999 | JohnW

| | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | Thank you vey much. | | | | rdgs... | | | Typical depends on the processes you're developing. | | Key factors in my experience are flux type and requi

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:07:59 EDT 1999 | JohnW

| | | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | | | Thank you vey much. | | | | | | rdgs... | | | | | Typical depends on the processes you're developing. | | | | Key factors in my experience are f

Reflow help needed, Hotflow 5

Electronics Forum | Fri Sep 09 18:19:25 EDT 2011 | cusackmusic

First of all, if you are going to tell me to throw my crappy equipment away, and buy a better oven because 3 zones isn't enough for lead free soldering, please find another thread to troll in. We have been using a Hotflow 3 for several years for lea

Re: Surface Mount Solder Balling

Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon

| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the


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