Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Wed May 16 11:40:11 EDT 2007 | stepheniii
I test pdb-boards on the mat it ain't work! Wrong > mount of bolts being outputted. is have something > to do witfh the rohas soulder on them? I will take a stab at translating. I test PCBs on a static mat but the test does not work. The output
Electronics Forum | Sat Aug 11 05:29:31 EDT 2007 | johnz
We are having a problem with JST connector ICM-MA50H-SS52-1161 LF SN. After reflow oven soldering we have mostly problem with soldering quality for firs or last leg of the connector. (There is no connection- leg just lays-lift on the solder no wicki
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Tue Feb 26 05:10:17 EST 2008 | adetuc
Thanks for the reply Hege, I calibrate the machines every 3 months and have checked that the board carrier to nozzle parralelism is ok. Have tried many different profile settings using a MOLE for readings but still collapsing on one corner. I did
Electronics Forum | Wed Mar 12 13:41:23 EDT 2008 | swag
We have a lead free assembly with a 128-Pin PQFP with 20 mil pitch leads. We have tried stencil aperture reductions, step-down stencils, different thickness stencils, various printer setting changes, placement pressure changes, nozzle changes, moved
Electronics Forum | Wed Aug 27 14:38:20 EDT 2008 | rgduval
Does your paste provider recommend a TAL? For the leaded and lead-free pastes that we use, the manufacturer recommends 60 seconds above liquidous. I note that your profile shows the TAL as 30 seconds, which may not be sufficient. That said, tho
Electronics Forum | Mon Dec 15 15:34:17 EST 2008 | dyoungquist
Sorry it has taken me so long to respond. I got pulled off onto other projects and was not able to work on the solution to the problen until recently. The solution we have come up with is to change from no-clean flux based solder paste to water sol
Electronics Forum | Fri Oct 02 11:23:08 EDT 2009 | floydf
Does anyone out there have experience soldering > with Pb solder (Sn 63 or Sn 62) to SAC 305 coated > PCB lands (about 50um) or Sn-Cu plated lands > (about 10um). I know soldering Pb free (Sac based > soler) to Pb/Sn coated lands is a no-no, but
