Electronics Forum: doe profile (Page 43 of 64)

BGA Placement Process

Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22

Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo

01005 components and reflow profiles

Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22

you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma

Flux Residues on Wave Soldered PCBAs

Electronics Forum | Fri Jul 29 06:16:19 EDT 2016 | dmsm123

We do have a commen problem with flux residues after the wave soldering process, even after using correct wave soldering profiles recommended by the flux supplier, The following flux type is being used Alpha EF 2210 VOC Fre Bellcore No Clean water Ba

Solder balls high on IC

Electronics Forum | Thu Sep 26 11:53:40 EDT 2019 | scotceltic

Experiencing some solder balls on an SSO-36 package. Things I am planning on checking are as follows: (not necesarilly in this order) I am just looking for a sanity check to see if you would try other things to help ? 1) Reflow profile. I have he

IPC pass/fail

Electronics Forum | Mon Nov 30 14:29:46 EST 2020 | kylehunter

Hi all. A recent board has shown some issues with graping and non-wetting on some 0402 capacitors. I believe we have the issue sorted. A combination of a 4 mil stencil with 2 mil reduction not giving us enough paste, and too long of a soak profile.

Re: Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon

| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U

Adhesive Application by Stencil

Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra

RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr

Re: KIC thermal profiler

Electronics Forum | Thu Jun 10 15:46:56 EDT 1999 | Chrys Shea

| Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like point-

Re: IP1 for Placement of BGA's?

Electronics Forum | Sat May 29 22:20:56 EDT 1999 | Earl Moon

| | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to a

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 13:34:04 EST 1999 | Earl Moon

| | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | Concerning the BGA stuff, I'm getting about 60% succes


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