Electronics Forum | Wed Sep 15 06:14:16 EDT 1999 | Wayne S.
| I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | Hello, you can get some insight by typing in double sided boa
Electronics Forum | Thu Sep 23 06:01:16 EDT 1999 | joel cruz
| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s
Electronics Forum | Thu Sep 23 06:06:20 EDT 1999 | joel cruz
| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s
Electronics Forum | Thu Jun 22 11:01:54 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Thu Jun 22 11:02:13 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Thu May 23 11:57:21 EDT 2013 | dyoungquist
We run the same profile for both sides. We also run the bottom temp 10C cooler in the final 2 heat zones.
Electronics Forum | Fri May 24 09:48:02 EDT 2013 | emeto
What you are saying is very interesting and it would be great if you later post this formula.
Electronics Forum | Fri May 24 09:34:57 EDT 2013 | markhoch
I run the same profiles for Top and Bottomside assemblies for all of my products. Only in rare instances have I been forced to run a profile with cooler bottom zone settings. This was obviously driven by assemblies with heavier components on the bott
Electronics Forum | Thu May 23 09:25:39 EDT 2013 | cyber_wolf
How many of you run a different oven recipe for the secondary side of a double sided reflow assembly. In other words, would you use the same recipe for both sides ?
Electronics Forum | Thu May 23 10:29:15 EDT 2013 | emeto
We would usually have the bottom zones at the reflow with 10 degrees less than the top ones for the secondary side. This we proved helps to keep the parts of the primary side on the board.
