Electronics Forum | Wed May 29 02:35:46 EDT 2024 | hananana
Communication system plays a vital role in modern society, but the corresponding interference problem is also becoming increasingly serious, which brings great challenges to the stability and reliability of communication system. In order to improve t
Electronics Forum | Mon Feb 23 03:10:05 EST 2009 | daan_terstegge
I'm looking for carton boxes for SMT-reels, as on this picture: http://img.photobucket.com/albums/v288/drone67/DSC00464.jpg They used to be supplied with parts from Philips, but they don't seem to make these anymore.
Electronics Forum | Thu Apr 20 21:45:10 EDT 2000 | Dave F
Wister: Oooo, I understand now what you mean by "an open." Sorry, I was (am) a bit dense. Your hypothesis is reasonable. On the other hand, have you looked at the traditional causes of tomb stoning also? For a defect to be a "tomb stone," it doe
Electronics Forum | Wed Apr 17 22:17:58 EDT 2002 | davef
OK. I give-up: * �Nuts & Volts� Magazine, September 1997, ENCYCLOPEDIA OF ELECTRONIC CIRCUITS: THE CD-ROM OF 1,000 CIRCUITS � PART 1 - TJ Byers - In this three-part series, TJ will show you how to use this CD to go from concept to copper, and build
Electronics Forum | Wed Jun 05 17:14:40 EDT 2002 | davef
First, I suggest that people search the SMTnet Archives in just about every response that I make. Second, you need to work on your DOE jargon * Factors. Independent or input variables * Effects. Results. Dependent or output variables. Third, the
Electronics Forum | Thu Jun 28 10:31:18 EDT 2001 | caldon
Borg Collective?????......7 of 9 is almost worth half my S&*% (Stuff) and becoming a drone. Guaranteed, I ain't dreaming of any Pick and place machines.If it were to happen the machine would be smattered with Hottie female operators willing to load
Electronics Forum | Fri Apr 23 12:10:41 EDT 1999 | Dave F
| A customer told me that pad geometry was to be different depending on soldering process. | | I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should
Electronics Forum | Fri Apr 19 15:49:56 EDT 2002 | davef
While our group is not involved in product FMEA, periodically we get dragged, kicking and screaming, into a FMEA for: * Quoting the assembly or test of products. * Evaluating the potential purchase of process equipment. * Assessing the potential impa
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Sat Jun 23 08:29:04 EDT 2001 | davef
Well, at least I don�t feel so bad that we�re not the only ones going anal on this blankin� cap thing. We�re gunna change process on ever effin wave soldered SMT cap!!! I�m going to off myself!!!! And in about 15 seconds, some doodoo brain is goin
winsouce.jpg)
.gif)