Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea
Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b
Electronics Forum | Thu Jun 15 14:20:21 EDT 2000 | Kevin Simpson
Hi Peter, The Disk you are refering to can be outsourced from several different vendors. The thing to be careful with is getting a consistant colored disk. You don't want to have etc... some dull/bright..etc. We have found one local vendor we use.
Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F
0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would
Electronics Forum | Tue Jun 13 22:00:10 EDT 2000 | Dave F
Suan: I'll take the "easy half" of your question I suspect you�re talking about Kleenox. It is a powder that you can sprinkle on your dross bed. Several points are: � Kleenox does not reduce dross. It reduces the amount of solder entrapped in dr
Electronics Forum | Tue Jun 13 14:14:40 EDT 2000 | Deon Nungaray
Dear Mr. Cunli, I think it would be useful to have the ability to access the archives easily. However, I do have a comment on your home page format. In the past the SMT Forum entries were viewed on the top middle upper section of your home page and
Electronics Forum | Mon Jun 12 10:57:51 EDT 2000 | Jason
I am new to wave soldering. Any information is greatly welcomed. Here is the problem. After soldering the boards they have a film on the bottom of them and sometimes a white powder looking substance. I have tried decreasing the amount of flux on
Electronics Forum | Mon Jun 12 14:03:12 EDT 2000 | MikeF
Jason, First, check with the manufacturer of the flux you are using. They can tell you what board topside temperature range the flux is designed for. Some other info is needed for the residue part. Is it showing up on the same board, or different boa
Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via
