Electronics Forum | Tue Nov 20 23:04:10 EST 2007 | wim
I am currently looking at selective solder > machines. The two that i have looked at are the > KIss 104 and the APS Novastar SP A400. Both > machines are in the price range i need to be in. > There are very different from each other as far > as
Electronics Forum | Tue Nov 27 19:41:53 EST 2007 | g2garyg2
Well, there seems to be many opinions, many of which could be correct, however... With the proper laser they can be quite good for soldering. Here are a few guidelines I would like to suggest. 1) Have your product soldered first (by the vendor) 2) T
Electronics Forum | Tue Nov 20 20:26:54 EST 2007 | davef
Peter: The above link to the the picture of the assembly is broken. Comments are: * Yes, RTV is completely useless for applications like you describe. Epoxy is a much better choice. * Dave G, in an archived thread on SMTnet, talks about using 3M Jet
Electronics Forum | Wed Nov 21 09:19:09 EST 2007 | Paul M.
Need some opinions from you fine folks. We are building assemblies 90% SMT, 10% TH. Fine pitch and BGA devices, etc. The customer is complaining about cold solder joints (SMT) after about 1 year of use, scattered thru-out the assembly, not consistan
Electronics Forum | Fri Nov 30 00:51:10 EST 2007 | vinitverma
Here are the differences (Eclipse vs Eclipse II) Optimum Speed: 5000 vs 6500cph Feeder Positions (8mm) : 80 vs 94 PCB Loading Time : 4s vs 5.3s PCB Thickness : 0.6-3mm vs 0.5-4mm Max Component Size : 32mm vs 45mm (optional camera possible on Eclipse
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc
Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't
Electronics Forum | Mon Dec 03 20:30:58 EST 2007 | shy
Q: I thought you said that the parts that weren't wetting in reflow were the parts with epoxy. A: Yes you're correct. Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in ref
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