Electronics Forum: energy chain (Page 1 of 1)

Type 4 powder

Electronics Forum | Thu Jul 25 12:25:54 EDT 2019 | davef

In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said: What change constitutes a need for requalification? Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, so

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll

Re: Hey Ya'll, let's talk about Lead fer' a bit...

Electronics Forum | Sun May 02 18:44:26 EDT 1999 | JohnW

| | How's the "Great Gas-out" going for ya'll? | | | | Myself, I'm doing real good! Haven't farted all day...(GRIN) | | | | Anyways, a thread got started down below about this so-called "Lead Free" stuff, and I just wanna' put my two cents in about

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