Electronics Forum | Mon Dec 16 13:03:00 EST 2019 | SMTA-Norah
Passives are at least fairly simple, generally either they solder or they don't, testing with paste stenciled on to glass slides is one variation and a hot solder dip is another. The glass slide is nice because it's closer to the end use scenario.
Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon
| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe
Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa
| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d
Electronics Forum | Tue Nov 25 11:58:31 EST 2008 | rway
Hello all, We are using z1850/60 machines. The APC test is damaging a 1.8V device on the board. The APC stimulates -/+3Vdc in fast mode. I understand the dangers of over-voltage. But what I need to know is how the part is being damaged when the ent
Electronics Forum | Sat Jun 20 19:49:39 EDT 2020 | kylehunter
Hi all. We recently expanded our assembly space and moved our Heller 1500 oven to a new spot. In the old arrangement, we used a Purex filtration unit, keeping the hot air in our space. Recirculating the fumes caused a massive headache in cooling the
Electronics Forum | Tue May 30 11:51:43 EDT 2000 | JAX
Sal, I have seen this problem placing SMT connectors which exceed 60mm in length. Although I did not use siemens equipment at the time I am not sure if they will place enought force to seat the entire connector flush to the board. They have a maximun
Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon
| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec
Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
Electronics Forum | Mon May 02 12:28:03 EDT 2016 | adamjs
Why can't you place the entire job the same day you paste it? I can. But setting up and properly cleaning the stenciling machine takes 2-3 hours. We only run one shift. If we do that every day we're spending most the time on setup+teardown. Much
