Electronics Forum: external qfn package crack (Page 1 of 1)

Anyone facing QFN package crack problem ?

Electronics Forum | Tue Nov 27 20:51:18 EST 2007 | chs

Anyone can share experience on package crack for QFN package. This package is so sensitive to any external force. Any good recomendation on desoldering / rework procedure.

Anyone facing QFN package crack problem ?

Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs

Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire

Anyone facing QFN package crack problem ?

Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika

Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 20:03:36 EST 2007 | chs

Hi, Thanks for the info. You mentioned about TQFP, how about QFN, which is leadless and one sided package compared to TQFP ? Actually, we are component manufacturer. Recently we have multiple customer come back with issue of electrical failure on par

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson

I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha

Anyone facing QFN package crack problem ?

Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson

Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef

From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject

CP45FV Neo Parts teaching

Electronics Forum | Fri Aug 26 19:59:02 EDT 2016 | mhanrahan

We've just purchased a CP45FV Neo to replace an ancient Panasonic line. First non-Panasonic placement equipment I've worked on, so learning as I go here. So far it's been pretty straightforward. However, we use some parts that come in QFN or LCC p

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