Electronics Forum | Mon Jun 04 11:01:23 EDT 2007 | hussman
Sorry to hear that RDR. Although, I thought the statement was "drive" a Harley (not own), which I find funny. Also sorry to hear about the Vette too. Should we make it a rule that the guy with the biggest spoiler is right? Then we can make a movi
Electronics Forum | Tue May 14 20:58:42 EDT 2002 | davef
Maybe the issue is not a proper rework method. Your shorts on the corners are caused by too fast of a profile causing the corners of the BGA to get too hot, too fast, which made them curl, like tatter chips.
Electronics Forum | Fri Sep 02 12:47:27 EDT 2005 | james
Thanks to all. I have it straightened out. We were running too hot and too fast and too long of a reflow time. I am running with Kic2000 and it works great. Thanks for all your input.
Electronics Forum | Wed Oct 30 05:55:49 EST 2002 | ahobby
Don't print too fast (
Electronics Forum | Thu Jun 26 09:33:11 EDT 2008 | realchunks
Yes, try slowing it down. It will indicate if your ramp up is too fast.
Electronics Forum | Mon Feb 13 08:30:59 EST 2017 | westshoredesign
Den, Just a hunch- I think you might be ramping too fast.
Electronics Forum | Fri Feb 18 11:14:07 EST 2005 | russ
I would be willing to bet that you are ramping up way too fast and possibly too hot/long of a soak and killing your flux activity. this will give the appearance of "no reflow" due to non-coalescence of the solder balls. check this board with the hel
Electronics Forum | Wed Jun 25 12:11:43 EDT 2003 | stepheno
We have a 5 zone oven and were starting at 150 which brought it up too fast. Even with only a 5 zone starting at 140 we get the temp up to soaking temp fast enough. ( I think too fast actually) What kind of oven do you have anyways? And I can't
Electronics Forum | Wed Jun 15 13:08:43 EDT 2011 | hegemon
Check your reflow profile as well, it could be that your ramp rate from flux activation to reflow might be too steep. This is in the same line as the post from Ken. Too fast a rise in temperature will collapse the outside rows too far in advance of
Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist
Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.
