Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
Electronics Forum | Tue Oct 22 13:28:03 EDT 2002 | slthomas
Brian, Since the change, I have seen numerous instances of extra zeros being added to numeric values, typically those of 3 (original) characters or more. Case in point, a contribution by our friend Mr. Fish that I have cut and pasted: "The steadfa
Electronics Forum | Tue Nov 05 18:17:00 EST 2002 | russ
This sounds like a contamination issue with the HASL finish.(solder on lead but not on pad). I have experienced this before and it was related to the HASL process at our supplier. They found some type of contaminate in the bath (unfortunately I can
Electronics Forum | Wed Nov 06 12:56:10 EST 2002 | slthomas
What I'm seeing is an occasional pattern of tear drop shaped features in a sea of nice shiny solder. The little islands don't really have any relief.....it's more of a surface finish feature than a 3-dimensional feature. The wetting angles are good,
Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas
Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde
Electronics Forum | Thu Jan 16 05:42:18 EST 2003 | nifhail
I've a query. I have one new Customer whom insisted us to use RMA paste on their product. The problem is, on some of their products they use via hole as the test point in where all the PCB finished are ENTEK and as usual I have to print solder paste
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Wed Mar 12 16:04:24 EST 2003 | O' Connor
Everybody thanks for all your help, the problem has been solved. Before I describe the solution I've got to own up, I'm the PCB Design Eng., The Process Eng. lobbed this problem onto my desk last week, said the problem lay with the PCB finish, whats
Electronics Forum | Tue Mar 11 10:19:00 EST 2003 | yngwie
We ran doublesided SMT thru Glue and Wave process before and but faced a lot of skip solder. Then the customer told us that they have similar problem when they ran the board so what they did was they print the paste-dispense the glue- place the comp
