Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont
I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Fri Jun 23 10:00:08 EDT 2000 | Chrys Shea
Yeah, them soldering machines sure got some demons in them...My waves used to get blamed for wrong polarities all the time. Sneaky little devils used to pull components out of the boards, flip them around, and get the pins back in the holes while
Electronics Forum | Fri Jun 12 15:24:30 EDT 1998 | Steve A
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Sun Jan 28 15:34:01 EST 2001 | Kelvin
Dear David, I suppose you may contact Cookson Performance Solution. They offer quite a wide range of service. http://www.cooksonsolutions.com I hope you find it useful. Kelvin
Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Sat Jun 07 23:37:34 EDT 2014 | demzvill
Hello all Good morning. I just want to ask with you guys about the problem that we always experienced in our production. We could not get our target ppm due. to inverted placement of chip resistor. We are using 2000 series juki mounter and cf03hp j
Electronics Forum | Wed Jun 11 16:41:57 EDT 2014 | isd_jwendell
With Essemtec software you can specify to turn on vacuum once the nozzle is down at the part. The default method is to turn on the vacuum while the nozzle is up, but starting to move down. For light/tiny parts this can have the effect of making them
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
