Electronics Forum: foreign material issue (Page 1 of 61)

PCB material

Electronics Forum | Fri Dec 10 01:02:36 EST 2010 | sparrow

Hello, our products are made on single-sided boards and we often have problems with receiving too warped PCBs from our suppliers. Can anybody suggest a good laminate or the most important properties of the material so we could specify it when we orde

Compressor air line material

Electronics Forum | Sat Jun 23 11:35:58 EDT 2007 | grantp

Hi, Yes, we just built a new plant, and used copper again. The stuff we cut out of the old building was copper, and it was fine without any issues. We lay it on an angle so condensation flows to an end, and can be periodically vented, and we take a

silkscreen issue

Electronics Forum | Sat Mar 04 13:26:41 EST 2006 | jldowsey

Something unusual happened yesterday, we reflow soldered two boards with white silkscreen legend, and they came out of the oven with purple silkscreen legend. Not tan or brown from overheating, but purple. The boards were reflowed on their normal pr

force between the pad and laminate material

Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny

When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b

lead pull out issue

Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef

First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i

Unusual solderability issue

Electronics Forum | Mon Apr 19 11:26:32 EDT 2010 | davef

Independent Labs * American Competitiveness Institute; One International Plaza Suite 600, Philadelphia, PA 19113; 610-362-1200 F1290 info@aciusa.org * Bodycote Materials Testing , 847-676-2100, na.bodycote-mt.com * Foresite 765-457-8095, http://www

BGA thermal reflowing issue

Electronics Forum | Fri Sep 26 07:26:33 EDT 2008 | realchunks

Looks like lack of wetting. What is the BGA ball material? Could be high temp. Could be improper profile. Could be paste sat on board too long / flux dryout. Could be co-plane mount and this ball touched at the end of reflow curve. Could be cont

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 10 08:00:14 EDT 1999 | Timothy O'Neill

| | | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so

CF CARD issue

Electronics Forum | Mon Aug 13 08:13:50 EDT 2007 | davef

Hi Bud We buy what you're selling, when you say, "I suspect ... coo planarity of the connector during soldering (bending like banana) and that is why first or last leg is not soldered." This component is probably acting like some BGA that curl at t

SMT Custom connector soldering issue

Electronics Forum | Mon Oct 29 19:48:03 EST 2001 | davef

Sounds like the connector is not solderable. * Do they take solder when hand soldering? * Do they take solder when using a hotter flux than you normally use? * What flux are you using? * What are the materials used in fabricating these connector le

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