Electronics Forum | Mon Apr 17 10:21:21 EDT 2017 | dontfeedphils
So I'm starting up a conformal coating process from scratch (again, although it's been about 10 years) and I'm looking for the best option for verifying thickness. I plan on going the "coupon per setup" route which will encompass both our manual spr
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
Electronics Forum | Fri Nov 16 03:23:15 EST 2007 | jwsmt
I'm requesting assistance in developing detection and containment methods for an issue with an SMD ceramic resonator (Murata CSTCE-G-A family). The returns have external visual cracks that originate at the termination and run at approximately a 45 d
Electronics Forum | Mon Feb 05 11:45:07 EST 2001 | peterbarton
Phil, One source for this information is form the manufacturer Park/Nelco. They have a large website and give specifications for all sorts of laminates, including FR4. Try http://www.nelcointernational.com/parknelco/fr4epoxy.htm. I'm sure that ot
Electronics Forum | Wed May 24 16:29:34 EDT 2006 | smt_guru
Yet another example of narrow focus. "What's the best and latest machine out there, and should I use a technology that's been around for decades." Wrong approach there, Chunks! Think outside the box. My firm, Worldtronics Consultancy Services, In
Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan
Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use
Electronics Forum | Sat Jun 13 11:00:21 EDT 1998 | Earl Moon
| We are very concerned about outgassing in wavesoldering. | If anyone knows how to use properly well pcb's before soldering in order to avoid this problem please let me know. I have this problem in FR4 large double sided pcb's. My soldering line is
Electronics Forum | Mon Mar 05 16:16:08 EST 2007 | Mark
Hello, We are having issue with one of the customer board. This is 10 layer PCB FR4 with black solder mask. Coating Ni/Au. Soldering leadfree. We are using 7 zones air reflow oven (zones top&bottom). We have bed solder flowing for this boards. T
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Fri Oct 08 18:26:19 EDT 1999 | Dave F
| | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | PCB is FR4 | | Solder Mask is LPI | | Reflow and W/S Profile = Standard | | | | t
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