Electronics Forum | Wed Nov 07 13:13:50 EST 2007 | dyoungquist
MyData has a spreadsheet macro that converts an Excel spreadsheet into the format that the machine can read. First you make up an Excel spreadsheat with the data in this column order: X center, Y center, Rotation (theta), Part number, Reference desig
Electronics Forum | Wed Nov 07 13:00:41 EST 2007 | jdumont
Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di
Electronics Forum | Wed Nov 07 13:36:20 EST 2007 | jdumont
Hello all, we are having issues with some specific package type aluminum caps we use while running lead free. We used to run these leaded with none of these issues. Basically we are not getting more than 25% hole fill on these parts. I have tested di
Electronics Forum | Fri Nov 09 07:40:07 EST 2007 | jdumont
Thanks for all the great suggestions guys. We do not have topside heating but topside temps are where they should be before hitting the wave. No excessive copper in the area either. We are going to start with the most problematic board and use it as
Electronics Forum | Mon Nov 12 07:59:38 EST 2007 | ck_the_flip
N ot another thread on PCB support! O f all the topics, this one has been much repeated. T o each his own, i guess for brining up this H eck, this topic is almost as repeated as stencil cleaning. E ngineers SHOULD be hands on, I agree. No
Electronics Forum | Thu Nov 08 06:12:03 EST 2007 | mattkehoe
Can someone point us in the right direction? We are trying to find a formula to determine the "cubic mils" of solder we end up with after reflow. (No components during the reflow) Some of the discussions we've had about it produced the thoughts bel
Electronics Forum | Thu Nov 08 08:41:15 EST 2007 | mattkehoe
Wow, that is a lot of info so early in the morning. What we are attempting is way less complicated than all that. 1 surface mount footprint, printed and reflowed without a component. Just a fused solder deposit on each pad. All pads the same size
Electronics Forum | Mon Nov 19 13:13:51 EST 2007 | hegemon
We have found differing results based on the pattern used when reducing to total % of solder paste on the center pad. We arrived at 68% coverage on the center pad, and 1:1 for the perimeter pads. To get the 68% coverage we used a number of differen
Electronics Forum | Tue Dec 04 10:30:16 EST 2007 | slthomas
Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong
Electronics Forum | Mon Nov 26 14:13:55 EST 2007 | wayne123
I am not completely sure why it would tell you "board will not be populated" and then build it anyway, but if the only difference between the two programs (working one, not working one) is the fiducials are smaller, did you try reducing the search ar
