Electronics Forum: go- (Page 472 of 785)

Re: Board Warp And Twist

Electronics Forum | Tue Aug 08 20:43:41 EDT 2000 | Dave F

Tom: So is warp or is it twist? They�re different problems, possibly with different sources!!! And possibly different solutions!!! Consultants to talk to are: Earl Moon (pod@vcn.com), Werner Engelmeyer (engelmaier@aol.com), Les Hymes (les.hymes@w

Re: wave solder bridges

Electronics Forum | Thu Jul 27 12:54:53 EDT 2000 | John Thorup

Hi Jason I think Wolfgang has this one nailed. If it's the same four pins every time and nothing changes this, even rotating the board 90 degrees, then you're probably going to find something like a ground plane connected to them. I don't think sol

Re: Automatic Inspection Equipment

Electronics Forum | Mon Jul 17 07:45:31 EDT 2000 | Alex Wong

I think you could look at the phenomena in two dimensions. Many of the sub-contractors in Asia are focus on low price-less demanding products. They hire operators to visually inspect the boards and sometime there is no inspection at all. On one ha

Re: HASL Plating Thickness

Electronics Forum | Wed Jun 28 12:37:05 EDT 2000 | Brian W.

HASL plating, by its very nature, is inconsistent in terms of thickness and consistency. The plating varies from spot to spot on the pad, as well as pad to pad. This will wreak havoc on your screen printing process and your placement. From talking

double sided reflow

Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason

We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?

Re: Underfilled CSP mechanical test

Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F

Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma

Re: Curing of Glue for SMT Components

Electronics Forum | Thu Jun 15 22:06:15 EDT 2000 | Dreamsniper

Hi Raeto, 1. You do not have reflow oven. This means that you are not running Surface Mount Technology in your shop floor...am I correct? Why do you plan to have SMD's under your PCB's ? Can't you replace them with their PTH counter part and have th

Re: Fuji CP6 nozzle reflective disks

Electronics Forum | Thu Jun 15 14:20:21 EDT 2000 | Kevin Simpson

Hi Peter, The Disk you are refering to can be outsourced from several different vendors. The thing to be careful with is getting a consistant colored disk. You don't want to have etc... some dull/bright..etc. We have found one local vendor we use.

wave solder

Electronics Forum | Mon Jun 12 10:57:51 EDT 2000 | Jason

I am new to wave soldering. Any information is greatly welcomed. Here is the problem. After soldering the boards they have a film on the bottom of them and sometimes a white powder looking substance. I have tried decreasing the amount of flux on

Re: Info on Universal Instruments?

Electronics Forum | Thu Jun 08 21:14:31 EDT 2000 | Thomas Ravener

You asked about info on a line. The only responses have been on a single machine. What type processes are involved? Are you doing a mixed technology application? UIC has probably one of the best technology application labs in the business. But all of


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