Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX
Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh
Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX
Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh
Electronics Forum | Tue Feb 01 06:54:19 EST 2000 | Roni H.
Hi, Does anyone have experience with gold over nickel (electroless) PCB finish: - Repeatble quality from PCB mfg. (very "painfull" with ENTEK). - Environment condition sensitivity. - Thermal processes sensitivity. - Solderability (Reflow & wave). -
Electronics Forum | Fri Sep 10 14:29:48 EDT 1999 | Doug Philbrick
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon
| | We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi
Electronics Forum | Fri Sep 10 14:32:49 EDT 1999 | John Thorup
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Wed Apr 01 11:35:24 EST 1998 | Big Manny
I've had some field reliability and Accelerated Life Test (ALT) issues with BGAs on Entek coated Cu. > The best results so far are with Atotech coated Gold electroplate finish. > Solderability, for factory process, seems to be as described by Justin
Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F
Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP
