Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Fri Jun 16 11:08:30 EDT 2000 | Travis Slaughter
Did you try preheating the board then hand solder? Those little heat shrink guns work great for this.
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Fri Jun 16 11:28:53 EDT 2000 | Boca
Solder 'follows' heat. 1. Preheating is a great idea, use a baking oven to get the whole assembly up to temperature, use the preheaters in your wave solder machine (without wave) to preheat the assemblies ... 2. Or use the biggest soldering iron
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Mon May 23 08:22:31 EDT 2005 | davef
Thermal mass is the ability of a material to absorb heat energy. * A lot of heat energy is required to change the temperature of high density areas, like a ground plane. They are therefore said to have high thermal mass. * Light weight areas, such as
Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef
Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny
Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro
