Electronics Forum | Tue Nov 25 10:11:25 EST 2008 | slthomas
What are you currently using to store boards in between processes and/or work stations, and during manual assembly (assuming there is some)?
Electronics Forum | Wed Sep 12 03:43:48 EDT 2018 | vlad_saviuk
Hello, have some problem and interesting, does any body faced with same issue. On most of our products we have NTC thermistor(like on the photo), and during assembly process and handling great amount of components cracked on PCBA so we need to replac
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Tue Jan 26 19:43:02 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jan 26 19:43:26 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Thu Sep 14 13:13:29 EDT 2006 | Kevin W. Parker
I am a tool and process engineer responsible for the cleaning system at Siemens VDO in Huntsville, AL. I have been over this area for more than 8 years. We use EMC Cyberclean 3000RF spray in air cleaners with Zestron SC202 chemistry. At this facil
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Sun Feb 13 15:23:03 EST 2005 | Mike Konrad
There are several manufacturers of batch-format de-fluxing systems. Here is a list of them: Aqueous Technologies http://www.aqueoustech.com (909) 944-7771 Batch and Inline UnitDesign http://www.unitdesign.com (714) 672-9944 Batch Austin American T
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
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