Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.
You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test
Electronics Forum | Fri Nov 03 11:36:34 EST 2006 | mika
Hi, It is good news to "hear" that You found the problem. This control board has also broken for us once but we had a broken camera unit from where we took this board as a replacement. Unfortunately I was not able to find the circuit diagram (among a
Electronics Forum | Fri Apr 27 12:08:43 EDT 2007 | Machine Designer
In the infamous words of one of my good customers. "Vision systems suck, it's just that some suck less than others" and he would know having hand built AOI systems internally for over 10 years. Do you have any idea how many people think one-off mac
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
Electronics Forum | Wed Jul 28 12:02:48 EDT 1999 | Wolfgang Busko
| | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That wou
Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon
| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob
Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis
