Electronics Forum | Thu Dec 21 10:27:24 EST 2006 | realchunks
>>> Now you must take into account your total board mass as well. If you have tons of heat sinks, or parts on the other side that can affect your profile, you should have them on the board when profiling. That�s where the "engineering" part in all
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22
Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo
Electronics Forum | Thu Oct 17 17:29:46 EDT 2013 | lordofpiggies
Hello. We are building a CCA which has a silicone-based adhesive whose purpose is to bond the bottoms of multiple LED displays to heat sinks. Our customer wants the CCA to be tested for ionic residues per J-STD-001, but we are hesitant to test the
Electronics Forum | Mon May 05 13:40:28 EDT 2014 | rway
The vent is there for reasons as the name implies. It's a safety feature to prevent the cap from exploding if over-tasked. Yes, without the relief on the end, the caps have a potential to become missiles when they go. I had one go off when my hand
Electronics Forum | Tue Jan 14 11:53:44 EST 2020 | avillaro2020
Hi Phil, thanks. I am successful using the same connector on small thinner boards 2-2.5kg) i cant make it work, tried all kinds of profiles with vapour phase but to no avail. Yes you read it right 4.3-6.3mm pcb thickness and 2-2.5Kg. And it is 44 lay
Electronics Forum | Fri Feb 05 09:22:25 EST 1999 | Dave F
| | | Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F | | Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via hole
Electronics Forum | Tue Aug 22 10:56:52 EDT 2000 | James
Actually Wolfgang that's what I was getting at. We use pallets all the time with a spray fluxer, hot pallets, and water soluble flux with minimum problems. My point was that if you use pallets at room temp the pallet sinks the heat and prevents the
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Thu Feb 10 22:31:11 EST 2000 | Dave F
CK: If you�ve done everything under the sun process-wise at the wave: different fluxes, more heat, less heat, more contact time, and less contact time; and are running out of ideas; let me table some thoughts. � "Don�t mess with Mother Nature."
