Electronics Forum | Wed Jun 10 04:00:46 EDT 2020 | ameenullakhan
Hi Phil, we used RSS profile initially , because of tombstone issue at 0201 package. We are planning to reduce soak a now to have flux till the end of reflow to avoid HIP now. and to support that . we are increasing over aperture opening also. Re
Electronics Forum | Wed Sep 12 11:03:35 EDT 2007 | cyber_wolf
Ya I am hip on the caps. These blowers squeel then quit.
Electronics Forum | Tue Jun 09 12:08:34 EDT 2020 | dontfeedphils
Any reason you're doing a RSS profile rather than a RTS?
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Tue Jun 23 13:23:55 EDT 2020 | emeto
If you swear in having consistent print, I bet you it is the part. Some of these BGAs probably have missing or inconsistent balls.
Electronics Forum | Wed Dec 21 11:33:22 EST 2022 | SMTA-64304420
Does anyone have experience with HiP defects with DDR memory components that they would be willing to share? I am interested in SMT process corrective actions and repair processes. I can discuss this privately if needed.
Electronics Forum | Wed Dec 28 16:49:26 EST 2022 | emeto
HiP most of the time goes back to the component package itself. If they are on the periphery of the part, it is a result excessive of expansion and contraction from the temperature. If it is in the middle, other contributors come in place.
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Mon Feb 28 11:37:35 EST 2005 | PeteP
You may well find it is the powder used in the gloves. Distributors offer gloves without powder. Also beware of using hand products with Lanolin, Mineral oil, Rose Hip oil, etc around electronics assembly ... solderability issues may crop up and ta
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
