Electronics Forum: how to clean resin in soldering (Page 8 of 12)

Re: Too hot to handle

Electronics Forum | Fri Jan 29 07:55:52 EST 1999 | Wayne Bracy

| | | | | | Greetings, | | | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | | Also, is there any danger of the pcb's giving of

Re: Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon

| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U

Solder wetting to ENIG pads

Electronics Forum | Wed May 14 12:35:34 EDT 2008 | rgduval

Thanks, Chunks. That's the one point of the experiment that we haven't tried yet. Though, we came to the same conclusion just yesterday. Dave, so far, the most help we've gotten was from the paste manufacturer. I've involved the board house, but

Re: No Clean in High Frequency Apps

Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon

| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?

Freshman in SMT industry needing advice

Electronics Forum | Wed Sep 22 14:45:01 EDT 2004 | Michelle Ogihara

As many people have participated in this email string, including competitors and customers of Sawa, I would like to respond to especially one rather detailed email expressing concerns with this stencil cleaning system. Also, this teaches me to keep

Re: Conversion to no-clean solder paste

Electronics Forum | Tue Jan 25 13:06:47 EST 2000 | Bill Schreiber

When switching from cleaning RMA to a no-clean flux, one area that is commonly overlooked is the stencil cleaning operation. Stencil cleaners that are effective in cleaning RMA often fail when cleaning no-clean (especially alcohol cleaners). Pallet

Freshman in SMT industry needing advice

Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn

It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture

Freshman in SMT industry needing advice

Electronics Forum | Tue Mar 09 14:22:09 EST 2004 | billschreiber

There is an article on our web site by Richard Clouthier, �SMT Stencil Cleaning: A Decision That Could Impact Production.� He talks about how high pressure sprays can damage the delicate land mass areas between fine-pitch apertures. High pressure ai

Necessity of ROSE in commercial quality processes

Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS

3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly


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