Electronics Forum | Mon Oct 06 09:55:35 EDT 2003 | davef
While you are waiting for others to reply, search the fine SMTnet Archives on: * immersion and tin * imm and tin
Electronics Forum | Thu Dec 21 20:09:01 EST 2000 | Dave F
You are one lucky person to have access to the fine SMTnet Archives. They have over a hundred threads on immersion tin, white tin, and the other variants.
Electronics Forum | Sun Oct 05 06:37:41 EDT 2003 | christ
Hi all: I want to know the parameter and criterion about the process of immersion tin,could you be kindly to give me the hins about it in more detail.Thank you for your support. Best wishes christ
Electronics Forum | Wed Oct 08 06:55:36 EDT 2003 | christ
Hi Dave: Thanking in advance for your valuable response!
Electronics Forum | Thu Dec 21 15:58:49 EST 2000 | Josue Jacquez
Hi Guys! I'm looking for information regarding the Tin immersion process. Is somebody there with such info? Could you send me or explain me the process? I'll appreciate your help.
Electronics Forum | Thu Dec 21 15:57:36 EST 2000 | Josue Jacquez
Hi Guys! I'm looking for information regarding the Tin immersion process. Is somebody there with such info? Could you send me or explain me the process? I'll appreciate your help.
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21
Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Wed Jul 29 13:44:45 EDT 1998 | David Spilker
We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone had
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