Electronics Forum | Tue Oct 05 18:06:21 EDT 2010 | jry74
I have seen an increase in components with contaminated leads, mostly SMT parts. They give us solder wetting problems and insufficient solder joints. Our practice is to not use them and return them to the manufacturer. Are these parts solderable?
Electronics Forum | Tue Oct 05 18:06:53 EDT 2010 | jry74
I have seen an increase in components with contaminated leads, mostly SMT parts. They give us solder wetting problems and insufficient solder joints. Our practice is to not use them and return them to the manufacturer. Are these parts solderable?
Electronics Forum | Fri May 04 08:37:45 EDT 2012 | waveroom
SN100C is being used by 95% of our customers over the SAC305. The main reasons are Cost big savings easily $10.00 lb, nice shiny solder joints good for quality inspection. Very few people are using SN100C in SMT Due to increased temperature requireme
Electronics Forum | Mon Jul 29 15:30:45 EDT 2013 | markhoch
Nitrogen in Reflow is grossly over-rated...., in my opinion, and in the opinion of several very well known SMT Industry "God Fathers". Way too much $$$, for a slight increase in the process window. If you profile your oven specifically for your pr
Electronics Forum | Thu Aug 24 18:28:41 EDT 2017 | tey422
dwl is right. You just have to spend some time to play with all the ones that causing the most delay. I would say the timing for X & Y axis try to set to max speed first (as long as not drops before placing). Then, slowly increase the Z speed until
Electronics Forum | Thu Jan 16 05:10:46 EST 2020 | soupy
Hej, we have some connectors placed on our PCB. 2*30legs 0.5 After reflow we detect lifted legs in the AOI. Always on the outer corners. Is this something ye have experienced? And any possible solutions? Stuff we have tried: Checking the cop
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
Electronics Forum | Wed Nov 11 06:59:20 EST 1998 | Jim Mitchell
Scott - Good to see things are going well for you. With regard to your comments, Quad has introduced a complete line of Semi-conductor/APT machines (Q Series) that support both SMT and Semi-conductor applications. The machines were introduced in 19
Electronics Forum | Tue Mar 17 11:57:39 EST 1998 | Richard
| Jim and all, | I am with SMTnet and want to thank all of you for | your participation in the SMT Forum. The recent slow | down of the forum was caused by three factors: | 1. The amount of data has increased. We keep | 3 months worth of messages
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
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