Electronics Forum | Thu Jun 09 06:15:17 EDT 2005 | Clampron
Joseph, We have all been using lead free components for some time. Many passive already have a Pb free plating and we have not seen catastophic failures on them. From the information I have seen, I think this should be OK (with the exception of BGA'
Electronics Forum | Mon Mar 26 13:49:16 EDT 2007 | grantp
Hi, I don't know anyone who uses Mancorp, and apart from this forum have never heard of them. I guess the big problem I faced when getting into SMT is trying to find a machine that could do what we wanted at a good cost. I originally purchased MYD
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Fri Dec 03 16:00:48 EST 2010 | glenseely
When faced with high mass, high cost, sensitive PCBs and now with the added challenges of Pb-Free Vapor Phase is the only safe reflow method for component and joint integrity. A-Tek is the National Distributor for Asscon Vapor phase reflow. Asscon
Electronics Forum | Thu Jun 22 12:40:40 EDT 2000 | Boca
Everybody's right! Two concerns are proper preheat for the flux and reduced thermal shock to surface mount components. The stupid er dumb thing is that these can be at odds with each other. The flux vendor usually specs topside temp before wave.
Electronics Forum | Thu Mar 04 16:40:06 EST 1999 | Dave F
| Hi, | | For hand placement you should see about 150-200 ppm of errors (solder, placement, values etc) on a board populated of types such as 1206, 0805, SOT, Tantalum etc. . As for solely wrong components (component at wrong location) you can usual
Electronics Forum | Tue Apr 25 10:42:38 EDT 2006 | TMC
Almost all of the components on the bottom side are passives however, there are a couple of mBGA's and qfp's. I am aware that even if the components on the bottom do get reflowed, surface tension of solder will hold them in place. As far as IC's, w
Electronics Forum | Wed Feb 14 12:37:20 EST 2018 | horchak
Ameen Now I'm feeling sorry for you. If all the other components on the assembly have good solderability you have already proven the component is the problem. I spent 27 years in contract manufacturing and been in this situation many times. If your c
Electronics Forum | Tue Feb 22 14:20:55 EST 2000 | Sal
Please let me rephrase the question. Running passive side first and curing the adhesive using a reflow profile derived for 63/37 solder paste. After curing the board is flipped around, pasted and reflowed. My concern is when curing the adhesive usin
