Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef
Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e
Electronics Forum | Thu Mar 16 07:02:38 EST 2000 | Scott Davies
Does anybody have any experience or knowledge of processing PCB assemblies featuring pyroelectric sensor devices, the type used in Passive Infra-Red Sensor modules? Since these devices are, by definition, very sensitive to heat, how do you get round
Electronics Forum | Fri Mar 19 18:47:16 EST 1999 | John Gill
Hi Folks, This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the bottom.
Electronics Forum | Tue Jun 23 08:39:22 EDT 1998 | Jon Medernach
What is the level of interest in bulk feeding cpassive devices, caps & resistors, 0402,0603,0805? The component mfgs. tell me in 3 years 40% of the passive caps will be bulk fed. Their is currently about a 10% cost savings with bulk over tape & ree
Electronics Forum | Mon May 13 09:49:18 EDT 2002 | Roger
Is there any difference in performance when running paper tape or plastic? What's the smallest passive component that you have fed in the feeder? How does pressure sensitive adhesive (PSA) tape perform in the feeder? PSA has a tendency to transfer
Electronics Forum | Tue Dec 23 11:10:15 EST 2003 | dougt
Alright this guy's promising the world. If anyone uses this company as a result of this thread please let us know if your able to get 0805's, 0402's or 0201's that you couldn't get anywhere else. We don't have size constraints and have been using 12
Electronics Forum | Fri Mar 04 10:04:14 EST 2005 | jbrower
We use Alpha UP-78 (Older paste formula) and it works well for what we do. We standardized our stencils at 5mil with a 10% reduction on IC apetures and a home plate design on passive components. Additionally we use laser cut electro-polished stenci
Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
Electronics Forum | Fri Apr 24 07:55:12 EDT 2009 | davef
TOMBSTONING OF 0402 AND 0201 COMPONENTS: "A STUDY EXAMINING THE EFFECTS OF VARIOUS PROCESS AND DESIGN PARAMETERS ON ULTRA-SMALL PASSIVE DEVICES" Michael Yuen, Heather Benedict, Kris Havlovitz, and Tim Pitsch, Plexus Electronic Assembly Corporation, N
Electronics Forum | Wed Aug 08 14:27:00 EDT 2012 | hegemon
Vapor soldering has some advantages for heavy boards, especially in energy transfer to the board and solder. The soldering temperature is fixed by the boiling point of the liquid used, and will not exceed that temperature, another advantage. The tr
