Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Fri Jun 22 10:56:07 EDT 2007 | ed_faranda
5mil works great. Just make sure that you screen alignment is dead on. We're using a SAC305 with a home plate design. I ran a test a couple of months back and found that the home plate design works the best with 0402s.
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Mon Aug 22 06:33:43 EDT 2011 | janz
try to use stencil with "home plate" (arrow head) shapes of appertures for chips components. Any supplier of stencil can support you with this kind of design. janz
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar
Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Wed Nov 05 08:49:39 EST 2003 | Axl
You might want to try reducing your stencil aperture by 10% first off; if it still swims try using a home plate design. Also if your profile is going into liquidous to fast, this might cause the swimming as well, check your profile.
Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
