Electronics Forum | Wed Oct 21 16:23:11 EDT 1998 | Jeffrey Long
My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I di
Electronics Forum | Wed Oct 07 13:26:07 EDT 1998 | Clifford Peaslee
Dave, I did a quick test of printing in both IE & Netscape. My results show that IE prints the best, fitting in the whole page properly. Netscape comes close, just missing the edge of the tables and some letters on the right margin. I can only hop
Electronics Forum | Wed Oct 07 22:38:27 EDT 1998 | Dave f
| Dave, | | I did a quick test of printing in both IE & Netscape. | | My results show that IE prints the best, fitting in the whole page properly. Netscape comes close, just missing the edge of the tables and some letters on the right margin. | |
Electronics Forum | Mon Sep 21 09:45:17 EDT 1998 | Dave F
| am working on the design of a showboard to demonstrate our | assembly capabilities. we are working with double sided assemblies involving BGAs and CSPs. could someone suggest | types of BGAs/ CSPs (type, name, I/O, etc)that would be a challenge t
Electronics Forum | Thu Sep 17 08:31:34 EDT 1998 | Dave F
| can anyone help with information about I-shape of SMDs. | our Design includes this shape of contacts. we are searching for information on quality judgement of solder joints with I-leads on Pads. Please help. Tom: I saw your earlier post. I'm not
Electronics Forum | Thu Jul 23 16:49:04 EDT 1998 | Ted
I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wave sol
Electronics Forum | Sat Jul 25 01:15:54 EDT 1998 | Chiakl
| | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wav
Electronics Forum | Mon Jul 27 13:54:25 EDT 1998 | Ted
| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For
Electronics Forum | Mon Jul 27 13:49:53 EDT 1998 | Ted
| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For
Electronics Forum | Tue Jul 14 15:09:16 EDT 1998 | Steve Gregory
| Dear Colleagues: | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | I need data not opinions. | Thanks in advance for your help. | Sincerely, | B. Decker
