Electronics Forum: lead coplanarity (Page 10 of 12)

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Wed Apr 21 02:53:33 EDT 1999 | Raul N.

25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe

Poor soldering on fine pitch?

Electronics Forum | Fri Jun 09 12:13:11 EDT 2006 | Chunks

Rob and Pete are both right. "We" had the same problem, with just one manufacturer of the same style QFP (don't want to name names here). We had the same style of QFP from a different manufacture right next to the problematic one on about 3 product

Freshman in SMT industry needing advice

Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn

It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture

301-00030 CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF TOLC-140-3

Electronics Forum | Thu Jul 19 22:42:04 EDT 2001 | jax

I assume since you talk about adjusting the locking pin and changing tooling you believe the part is not being held down with enough force while being reflowed. Is this because the insufficent and open solder you mentioned is the lead sitting on top

Re: ENIG finishing

Electronics Forum | Tue Feb 15 11:48:30 EST 2000 | Steve Thomas

Thanks for your responses, gentlemen. I'm really just looking at options, and frankly, being a novice at this stuff I'm looking for the info. required to make a semi educated decision. You, kind sirs, are my educators. And that probably scares m

CONNECTOR ISSUE

Electronics Forum | Tue May 30 09:52:21 EDT 2000 | Sal

Problems with dry joints on a 184 pin Berg connector with locating pins.Using a 0.005"screen, on a n-tek finished board and using Nitrogen. The problem is really intermittent.We tryed using a variety of placement forces using our siemens F5. The comp

QFP Defect

Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie

Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane

Re: Wave soldering smt components

Electronics Forum | Wed Dec 15 04:59:40 EST 1999 | Joshua Hall

Hello KA, When producing in kind of PCB product you have to base much of your decision on cost effectiveness, time, and quality. In order to get the best of all three you have to decide which you want to be your top priority. By adding an epoxy to

Re: Collumn Grid Array

Electronics Forum | Tue Oct 19 15:16:38 EDT 1999 | Frank Stryker

The CCGA is like a BGA except that the columns are more square looking and there are many more of them. They are made of lead so they are very fragile. They are very expensive. There is a special cleaning process they have to go through once it has b

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:52:39 EDT 1999 | Scott McKee

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Let me get this straight... He's


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