Electronics Forum: leaded (Page 770 of 789)

Quad??

Electronics Forum | Wed Jan 24 08:46:23 EST 2001 | CAL

Here is the latest Press release. I do know Craig Ramsey VP, Marketing is no longer with Quad. last I saw the stock price was froze at $.38/share. My best guess is Quad will be consumed and re-released under a different name possibly the private lab

Upside Down Chips

Electronics Forum | Thu Mar 15 08:16:28 EST 2001 | davef

In a similar conversation ... Alex Krstic, NovAtel Inc. said ... Hello all. We recently received some boards with some of the chip resistors placed with their resistive elements towards the board. J-STD-001B and C view this as violation for both Cl

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef

First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff

Inspection Methods

Electronics Forum | Fri Jul 27 09:00:46 EDT 2001 | wbu

Hi Darby, you must have read my thoughts about the stuff we are dealing with. Think I�ve got to hide your message from my boss it may lead to the decision that I�m not allowed to read this and other forums anymore ;-). We still need optical inspect

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Thu Sep 30 07:03:05 EDT 1999 | Scott Cook

| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne

Re: MARKETING - HELP! E MADDY

Electronics Forum | Wed Sep 29 08:51:34 EDT 1999 | Wolfgang Busko

| | GUYS THANKS FOR THE INFO YOU SENT ME . NOW FOR MY | | NEXT QUESTION. HOW DO I MARKET MY COMPANY? WHERE | | DO I BEGIN TO LOOK FOR NEW CUSTOMERS WILLING TO TAKE | | A CHANCE ON A NEW COMPANY WITH NO PROVEN TRACK RECORD? | | WHAT ARE SOME OF THE Q

IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Thu Sep 23 20:23:58 EDT 1999 | Dave F

Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-by co

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Thu Sep 23 20:57:13 EDT 1999 | Dean

| Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-by

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 17:24:58 EDT 1999 | John Thorup

| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu


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