Electronics Forum | Sun May 22 23:09:22 EDT 2005 | Thaqalain
In which direction should the operator count leads on SMT leaded compomnents (i.e.,QFP) 1-Clockwise 2-Anticlockwise 3-Either
Electronics Forum | Mon May 23 08:17:34 EDT 2005 | mmjm_1099
In the northern hemisphere you count counter clockwise and southern hemisphere you would count clockwise. Now if your sitting on the equator than it can be either way.
Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
Electronics Forum | Wed Jan 14 08:45:04 EST 2004 | Kris
Thanks Dave Will appreciate if any body has any published information on a study they did for voids in leaded devices Will try to talk to them Dave
Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef
No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi
Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel
Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)
Electronics Forum | Mon Jan 19 18:49:42 EST 2004 | menglong
we are facing the same problem,and we are looking for some research result about voids.who can help to provide these ones ? any suggestion, pls keep me informed contact me :zhanglg@tpv.com.cn
Electronics Forum | Fri Jul 13 16:07:42 EDT 2007 | wana
Hello All. Can the experts in the lead free field guide me to the articles / data confirming that it is OK to use lead free components in the normal "leaded" (Pb) SMT process. And also if any changes in the process would be required to be made. Th
Electronics Forum | Thu Jul 19 09:23:52 EDT 2007 | patrickbruneel
Chris, To my knowledge the only difference between leaded and lead-free components is the termination plating. What has changed in the component design that makes them resistant to higher temperatures?
Electronics Forum | Sat Jul 14 08:49:16 EDT 2007 | davef
While you're waiting for others to respond, search the fine SMTnet Archives.
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