Electronics Forum | Wed Nov 30 18:49:41 EST 2022 | proy
I have done some initial testing and looks like a 60W C02 laser can be used effectively for depanelizing boards. Charing initially is significant but by reducing power and making multiple passes AND flooding with Nitrogen I expect this an be reduced
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
Electronics Forum | Wed Mar 15 11:34:28 EDT 2023 | proceng1
I'm sure this isn't the same situation, but we did have a selective solder machine with crazy dross and solder ball build up. Turns out the operator switched the low pressure nitrogen line used for solder level and the high pressure nitrogen line fo
Electronics Forum | Wed Mar 20 14:54:15 EDT 2024 | linux
Vacuum Low, Shows up on changeover when the head picks a different size nozzle, remove mesh filter, unplug the clear pipe from the top of the head, put a small amount of alcohol down the pipe and blow it out with the air gun, You should check for a h
Electronics Forum | Thu Mar 28 16:51:00 EDT 2024 | tey422
Since you only saying it's the hydra error, then only run the hydra calibrations. Sometime the calibration can end up causing more issue if not run it correctly. I would do the hydra camera Z level (1st). If it fixes the issue then you no need to do
Electronics Forum | Tue Oct 24 12:20:35 EDT 2000 | JohnW
Adam, Did some work on this a bit back via some good old Taguchi DOE and like Dave(the guru)F say's your component terminations is a big factor but I also foundthat the amount of flux you put on as well as the preheat's has an effect, generally we f
Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp
CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly
Electronics Forum | Sun Nov 07 21:40:14 EST 1999 | Chris
I am looking for an inertable reflow oven which will produce ROLs of less than 10 ppm. My current reflow oven will reduce oxygen levels to 10 ppm but only when using excessive nitrogen gas (4000 scfh). In reality less gas flow may reduce oxygen lev
Electronics Forum | Fri Feb 19 14:44:24 EST 1999 | Lance A. Smalley
You don't say what kind of machine you are using but several just use the edge of fiducials to determine area (and centers). If you are teaching in binary and have the ability to select a decision level (threshold), use a level half way between loss
Electronics Forum | Wed Feb 03 22:47:48 EST 1999 | Chris G.
| Hi! | | Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper. | | Teemu M�kiniemi | Teemu, For some time now, as I am sure you are aware, the PCB industry has been tryi
