Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Tue Oct 15 10:46:47 EDT 2002 | Dan Davis
I have a supplier that utilizes a soft beam solder process for through hole components. We are experiencing bridging and cold joints on components with narrow pitch between pins. They are dragging the solder over these pins as well. I have asked f
Electronics Forum | Mon Oct 21 07:54:38 EDT 2002 | yngwie
What is the best indicator to monitor the success in HMLV environment. Example, I think FPY is not the best representive of line's health. Agreed ? IS DPMO tracking is a better way ? What about downtime ? IS convertion time can be considered as one o
Electronics Forum | Tue Oct 22 12:47:01 EDT 2002 | kenbliss
Hi Yngwie I am not sure where you are trying to go with your questions, but it appears you are looking for a way to monitor how productive your production lines are running. With the assumption that these are SMT lines your are running you should f
Electronics Forum | Fri Nov 08 17:49:04 EST 2002 | davef
Questions are: * So, what is your thinking on this "insufficient contact causing intermitten failures"? * How do you print the paste? * Where do you place your therocouples when measuring reflow temperature? * What kind of solderability protection is
Electronics Forum | Wed Nov 20 10:33:14 EST 2002 | dphilbrick
Adam Generally the answer is yes. But there are many considerations. First a couple of questions 1 what flux are you using 2 Do you have top side pre heat in your wave solder machine 3 what is your measured top side temp. 4 what is your dwell time
Electronics Forum | Mon Dec 02 21:32:34 EST 2002 | davef
Sounds like you're killing the poor little critters. Tell us about: * Placement force. * Reflow method. * Where and how you are measuring your reflow recipe. * Cooling rate of the reflow recipe. * How the solder connection to the metalization appear
Electronics Forum | Thu Dec 05 22:46:39 EST 2002 | davef
While J-STD-001 specifies an upper limit for acceptance of assembly, we use Resistivity Of Solvent Extract testing as a process control. In truth, this "LT 10.07 �gm/sg in NaCl equivalent" measurement has substantial limitations, not the least of wh
Electronics Forum | Mon May 10 09:51:47 EDT 2004 | davef
Yes These instruments are intended for process control. So, it's unrealistic to attempt to correlate readings between machines. Read the EMPF report that Cal recommends here in this thread: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID
Electronics Forum | Sat Dec 14 02:51:24 EST 2002 | MA/NY DDave
Hi Thanks for this info. Hope someone new also enters. Funny I just picked up an article, too small, that writes that dots on some known pattern are used to measure distortion and then it shows distortion for square shapes (barrel and pincushion d
