Electronics Forum | Mon Jan 12 16:56:20 EST 1998 | Jon
There are a few reballing devices out there. Rework Solutions in San Jose, CA sells one. There are a few services that do it for a fee. One is Netco Automation. I am told they do a great job. I am not sure of the phone but they are somewhere bac
Electronics Forum | Wed Nov 14 09:48:56 EST 2012 | rway
It depends on what type of packages you will be working with. Will you be working with BGA/LGA devices or QFP. For QFP, Pace is a really good system. I would recommend a power supply with 3 ports: iron, de-solder, and hot air. You can replace mos
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Sun Jan 25 10:39:52 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Thu Oct 24 09:22:32 EDT 2002 | dscott
We are a supplier building prototypes. Most of our projects consist of boards with array packages down to 30 mil pitch. My concern is with customers that return boards for rework on array packages. Typically if their product is not functioning that i
Electronics Forum | Fri Jun 03 14:31:33 EDT 2005 | Peter
I am working on an application requiring removing BGAs from a board coated with parylene. These BGAs have low standoff with less than 0.015" after SMT soldering. Can some comment on a reliable and consistent process to perform such rework? given tha
Electronics Forum | Thu Jun 24 09:24:03 EDT 2004 | Rob
The smallest component we use is 0402. Solder paste is Kester 256. Printer is MPM Ultraprint 2000. Stencil is 6 mil. I didn't here anything bad (rework or whatnots) in terms of soldering of those components.
Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon
You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside
