Electronics Forum | Thu Oct 26 14:41:33 EDT 2000 | Derek Vanditmars
We are planning on replacing a SMT 100Pin QFP with a COB module that will have two dies that are functionaly equivalent to the old part that will not be available. Questions: 1)Suggestions on substrate material FR-4 or something better? 2)Are there d
Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto
Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Tue Jan 05 21:01:40 EST 2021 | brianjones
We are looking at setting up a memory module conveyor belt with a stacker and de-stacker. I will need to handle DDR3 and DDR4 Long DIMM and SODIMM. I will be mounting an image camera under and over the modules. Looks like an edge conveyor would be be
Electronics Forum | Sun Aug 28 22:19:34 EDT 2005 | sonata06
Origin: China Price: To Talk About Specification: 1)Thickness Of Silver Plating:From 2Um-15Um 2)Material:ABS or PBT 3)Cu-Ni-Silver 4)Earth Module,Profile Module,Profile Switching Module,Disconnection Module,Connection Module 5)Different Colors are
Electronics Forum | Wed Sep 14 02:41:49 EDT 2016 | bukas
here is well explained SMEMA interface http://www.daghee.com/?p=326 so, disconnect printer from upline modules and check are any 2 of 4 pins shortened(should be pins No 1 & 2) while machine is ready state. when machine is in busy state the same pin
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Wed Sep 23 00:06:34 EDT 2020 | SMTA-64387098
I have modules that come with a 4 x 2 pin header. The problem is the pins must be oxidized as they do not take solder (no wetting occurring). This occurs whether solder in our wave soldering machine or soldered by hand. I tried cleaning the module i
Electronics Forum | Wed Feb 13 09:30:32 EST 2019 | SMTA-Joe
*UPDATE* I decided to modify the experiment slightly by forgoing my attempt to achieve reflow with the component. Instead I applied SN42 paste directly to the pad and attempted reflow of the paste by itself. The end result is as follows: Hotplate
Electronics Forum | Fri May 14 08:31:07 EDT 2004 | todd_ferrell
We're looking for a contractor who can support high volume production of 0201 passives and 1-2mm csp's to create 4mm sq. RF modules as well as mold cap capabilities. Any leads would appreciated.
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