Electronics Forum | Sun Sep 16 18:57:29 EDT 2018 | spoiltforchoice
Visit the machines, get your quotes. Establish what you need, make sure you understand the running costs of each, the availability of service personnel & parts - see who wins. The answer won't be the same for everyone. Also see which software you lik
Electronics Forum | Tue Feb 12 09:12:37 EST 2019 | SMTA-Joe
Hello SMTA. I'm having issues reworking QFNs inside housings with a much higher thermal mass than any typical PCB. We have had demonstrations in-house using BGA rework stations that simply don't get the job done. The problem is threefold: 1) th
Electronics Forum | Wed Feb 13 08:15:05 EST 2019 | SMTA-Joe
We recently had an in-house demo with the smaller IR bottom heater PACE machine. The machine was barely able to remove some components, but could not replace new ones at all. Also, the nozzle for the hot air would not fit in the tight areas of the ho
Electronics Forum | Wed Jun 24 21:58:16 EDT 2020 | kumarb
Thanks Rob. They want to sell us a new TDM which does not sound correct as the entire TDM is with an offset. Logic is making us believe that the calibrated data is stored inside the onboard microwire eeprom. Do not know the format of these expected v
Electronics Forum | Mon Sep 03 21:33:41 EDT 2018 | aemery
Jeff R, The "24VS" stands for 24VDC Voltage Switched; meaning that it is supplied under machine control and other things have to happen in the machine before 24VS is applied, in this case to KP1 coil. KP1 coil/contact is in place as part of the pow
Electronics Forum | Tue Nov 07 08:09:19 EST 2000 | adam
WE are using press fit connnectors on a range of boards, one of which is posing me a few process questions . The Machine is a fully automatic machine. The problem is intermittent and I can't seem to put a finger on it. An array of connectors ( consi
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Tue Jul 11 13:21:30 EDT 2000 | Deborah Troxell
We use the Slimkic for our oven porfiles and run a very high product mix too. My first question is do you use the same progam for all your boards or do you run different temptures profiles for each module? How are the gold boards getting destroyed? W
Electronics Forum | Tue May 23 11:06:53 EDT 2000 | Michael Parker
Kathy- Greater than 88%. Is that 3-D Nicolet? I had a conversation with Arline yesterday, she told me about your trials and tribulations with re-balling. I would like to suggest you try micro-stencil instead. If your BGA rework center has the capabi
Electronics Forum | Thu Oct 26 17:42:29 EDT 2000 | Philip A. Reyes
Hi Mr Paul! Thanks for answering my previous questions. Hope you can still accommodate my other queries. This is about the acceptable criteria of PBGA defects after reflow soldering. 1.What is the allowable (min and max. ball misregistration / misal
