Electronics Forum | Tue Aug 06 17:14:33 EDT 2002 | melo_guy
I thought this would be a good place to post to get input from the "trenches" as to what is going to be the next consumer fad? It seems like the market is in need of something new to instigate future consumption. I work for an electronic component
Electronics Forum | Wed Aug 21 17:51:58 EDT 2002 | davef
Our sympathies on: * Working for a CM. Nufsed. * Living in Eastern Canada. Time find the snow shovel, eh? Consider: * Searching the fine SMTnet Archives for a list of used equipment resellers and refurbishers. * Using the SMTnet �Marketplace� [in
Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef
Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't
Electronics Forum | Sat Oct 19 11:48:39 EDT 2002 | davef
Good points, John. Continuing to track on the voiding issue, why remove voids anyhow? * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on at least on a temporary bas
Electronics Forum | Mon Nov 04 16:54:13 EST 2002 | pjc
For me it was the 1.0mm nozzle, if we're talking mini-MELF here. Also, slowing the turret speed helps. Had mine at 30%. Results vary if placing on paste vs. glue. Paste is better. Still, the std. 1.0mm nozzle is where near as good as with the MELF no
Electronics Forum | Tue Feb 10 13:58:43 EST 2004 | EHess
Scott, We have 2 Amistar Placepro 5620's and 2 5720's. One with a TF-14. I've personally been working on these for the past 10 years or so. Have a pretty good grasp of the process, if placepro's are what you are using. Glad to see Amistar is
Electronics Forum | Wed Feb 11 13:42:11 EST 2004 | fatally_phoenix
Scott, We have 2 Amistar Placepro 5620's > and 2 5720's. One with a TF-14. I've personally > been working on these for the past 10 years or > so. Have a pretty good grasp of the process, if > placepro's are what you are using. Glad to se
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
Electronics Forum | Thu Feb 06 13:57:01 EST 2003 | D. Brian Davis
I need some feedback on aqueous cleaners. We currently use a Unit Design batch cleaner. We will be looking to upgrade our board washing process and batch sizes in the near future. I am looking for user info. on the advantages/disadvantages to using b
Electronics Forum | Wed Feb 26 18:48:01 EST 2003 | kennyg
I'm trying to solder a 0.011" lead into a 0.015" +/-0.003" hole. Stop laughing please. This is normally possible with difficulty, except if the lead is removed and the attempt is made to re-install a lead. Anyone have thoughts on how to remove nea
