Electronics Forum | Thu Jul 15 11:17:03 EDT 2010 | davef
Things don't disappear completely. If something caused nickel corrosion, the nickel corrosion by-product would be in place of the nickel. Is it possible that ... There never was any nickel? We know that the nickel will diffuse into the copper. Th
Electronics Forum | Thu Jul 15 13:27:42 EDT 2010 | xps
Thanks... anyway I confirm, the nickel disappear (verified by cross section)and a strange substance greyish above gold, covering the tabs after test. I don't know the reason for this phenomenon. I don't believe that with proper electrolytic nickel fi
Electronics Forum | Thu Jul 15 06:27:50 EDT 2010 | xps
Hi after an enviromental test 85C/85RH, for 3 months (powered), of an electronic assembly with edge finger tabs ENIG finished (nickel 5micron, gold 0.02micron), the nickel disappears completely under the gold (due to corrosion, I think). Does anyone
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Thu Mar 31 13:48:19 EST 2005 | shannond
Hi All, I have to solder a device with platinum clad nickel leads to a PCB. I am having a hard time getting solder to flow on to the leads. Are there special proceedures that I need to follow because of the platinum or am I just dealing with contamin
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Tue Nov 29 22:32:51 EST 2005 | davef
The dissolution rate of nickel into tin is a lot slower than that of copper [into tin]. This results in a nickel-tin (Ni3Sn4) intermetallic that is only 0.25-0.75�m thin after a normal soldering process. The Ni-Sn intermetallic compound tends to be m
Electronics Forum | Wed Nov 30 06:23:32 EST 2005 | wmeyers
Thanks Dave! Bill
Electronics Forum | Sun Apr 27 18:38:55 EDT 2003 | Yngwie
One of my customer asking me about my capability on soldering nickel strip onto the PCB pad. Given the size of the pad of 80 mil X 80 mil, and he want to ensure that we can pass 4.5kg peel force(solder wire Sn63/Pb37). Anybody with this experience ?
Electronics Forum | Thu Mar 31 19:52:50 EST 2005 | davef
We agree with Russ that you're talking palladium instead of platinum. Your wetting problem likely is not the Pd-Ag surface layers, but the underlying metal or nickel to which you need to wet. Either a base metal is: * Contaminated and poorly wettabl
