Electronics Forum | Thu Mar 15 21:09:07 EDT 2007 | KEN
Cecil, the board is a component.
Electronics Forum | Thu Mar 15 10:28:46 EDT 2007 | cecil
Just askin but why would someone even want to subject an assembly to even 6 reflow cycles? As far as how many cycles that an assembly can be subjected to, wouldn't that be determined my your components?
Electronics Forum | Thu Mar 15 09:58:22 EDT 2007 | KEN
Anyone know which IPC document covers this? Me thinks 6....but want the IPC spec. to back this up.
Electronics Forum | Thu Mar 15 20:49:16 EDT 2007 | davef
There is no IPC document, nor should there be. Look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=48102
Electronics Forum | Thu Mar 15 12:33:50 EDT 2007 | ck_the_flip
To do a profile at most companies, if you don't have a scrap board handy, you'll use the already-soldered board that's already been through ONE reflow cycle. You spend time attaching T/C's with the aluminum tape - after all, the prep-work is half th
Electronics Forum | Thu Mar 20 14:17:39 EST 2003 | MA/NY DDave
Hi I don't think I will enter this too much except for one of your questions. YES multiple reflows affect reliability. Heck most everything affects reliability. Aggressive Heat cycles or Heat always affects the final MTBF reliability number. The
Electronics Forum | Thu May 13 20:38:32 EDT 1999 | lima
Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? My concern is the volatiles in my WS629 solder paste may be attacking th
Electronics Forum | Fri May 14 00:16:28 EDT 1999 | Mike D.
| Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | My concern is the volatiles in my WS629 solder paste may be attack
Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima
| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be
Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
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